정밀 세정
반도체 공정 부품을 ETCH·CVD·Diff·IMP 공정별 특성에 맞춰 정밀 세정합니다. 오염·잔류물을 제거해 부품 수명과 공정 안정성을 높입니다.
PROCESS 01
ETCH
- Lower / Upper Liner
- Liner MESA · C3 Screen
- SiC Shower Head
- CATHODE SLEEVE
- Bottom Ring · LID
- HUB MESA Gas Injector
PROCESS 02
CVD
- Gas Box Dome · Face Plate
- Gas Box Dome Heater
- Vector Bellows · Sin Mixing Bowl
- Spindle Plate · Vac Valve
- Heater Bellows · Lift Bellows
- Shower Head · Chiller Plate
PROCESS 03
Diff
- DPN Dome · EPI Chamber
- End Plate · Susceptor
- Elbow · Line Vac Exh
- VAC Line · Flange
- Bellows · TEOS Trap
- Upper Dome · Six Arm
PROCESS 04
IMP
- ASS'Y Ion Sources
- Manipulator Assy
- V4 Valve HCP · Trap Pack
- ASS'Y PEF · RED BUSUING
- Top Cover · Corona Ring
- TP1 Bellows · VAC Blade
세정 사례 · Before / After
ETCH · Liner / Plate
Shower Head / Screen
Diff · Flange / Elbow